CFP : IASTED International Conference on Optical Communications Systems and Networks OCSN 2003, part of IASTED International Multi Conference on Wireless and Optical Communications WOC 2003
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See: http://www.iasted.org/conferences/2003/banff/ocsn.htm

   
                              CALL FOR PAPERS
                      IASTED International Conference
                OPTICAL COMMUNICATIONS SYSTEMS AND NETWORKS
                                ~OCSN 2003~
                              July 14-16, 2003
                               Banff, Canada
         as part of the3rd IASTED International Multi-Conference on
               WIRELESS AND OPTICAL COMMUNICATIONS - WOC 2003
                              July 14-16, 2003
                               Banff, Canada

   SPONSORS
    IASTED Technical Committee on Telecommunications
    iCORE Wireless Communications Laboratory

   IN COOPERATION WITH
    IEEE Southern Alberta Section

   TECHNICAL CO-SPONSORS
    IEEE Technical Committee on Personal Communications (TCPC)
    IEEE Vehicular Technology Society

   PURPOSE
   The International Conference on Optical Communications Systems and
   Networks (OCSN 2003), sponsored by IASTED, will be a major forum for
   scientists, engineers, and practitioners throughout the world to
   present their latest research, results, ideas, developments and
   applications in all areas of optical communications systems and
   networks. Its aim is to strengthen relations between the
   telecommunication industry, research laboratories, and universities.
   OCSN 2003 will be held at the Banff Centre for Conferences in Banff,
   Canada, July 14-16, 2003.

   LOCATION
   Banff is Canada's first national park and a UNESCO World Heritage
   Site. The park is a year-round protected wilderness area offering a
   rugged alpine beauty in the heart of the Canadian Rocky Mountains.
   Banff National Park is home to a wide variety of wildlife, and has
   over six thousand sq. km of mountains, forests, rivers, and lakes.
   Each year, millions of visitors travel to Banff to marvel at the
   emerald waters of Lake Louise, walk amongst the flower-filled fields
   at Sunshine Meadows, and drive beneath the towering jagged peaks
   lining the Icefields Parkway. The town of Banff is situated just west
   of the city of Calgary, home of the world-famous Exhibition and
   Stampede.

   CONFERENCE SCOPE
   Relevant topics for OCSN 2003 include but are not restricted to:

   ARCHITECTURE, DESIGN, AND INFRASTRUTURE
   Optical Network Architecture
   Optical Network Multi-layer Design
   Fiber Design and Fabrication
   Network Design Software
   Synchronous Optical Networks (SONET)
   Inter-satellite Optical Links
   Inter-working between Optical and Wireless Networks
   Optical Network Management
   Metro and Access Networks
   Modelling and Simulation 

   OPTICAL FUNDAMENTAL TECHNOLOGIES
   Optical Switching Technologies
   Optical Packet Switching
   Light Matter Interaction
   Wave-guide Fabrication Techniques, including Ultra-short Pulse
   Approaches
   Propagation Characteristics
   Polarization Compensation
   Chromatic Dispersion Compensation
   Modulation Techniques
   Multiplexing (WDM, OTDM, CDM)
   Non-Linear Optical Effects
   Nanostructural Material Technology

   OPTICAL SYSTEMS AND COMPONENTS
   Light-emitting Diodes
   Lasers
   Optical Amplifiers
   Modulators
   WDM Systems
   Optical Switches
   Optical MEMS Components
   Filters for DWDM
   Transmitter and Receiver Subsystems
   Transceivers
   Amplifiers
   Active and Passive Components
   Fiber Wave-guided Components
   Optical Splitting and Directional Couplers
   Array Wave-guided Devices
   Sensors
   Fiber Cables
   Specialty Fiber         

   INTERNATIONAL PROGRAM COMMITTEE

   H. M. Abdu - University of Michigan-Dearborn, USA
   L. Andrew - University of Melbourne, Australia
   S.A. Barbulescu - University of South Australia, Australia
   F. Barcelo - Politechnic University of Catalunya, Spain
   J.A. Barria - Imperial College of Science, Technology and Medicine, UK
   J.R. Barry - Georgia Institute of Technology, USA
   C.W. Baum - Clemson University, USA
   M.S. Beg - Multimedia University, Malaysia
   G. Bi - Southeast University, PRC
   A.C. Boucouvalas - Bournemouth University, UK
   J.M.C. Brito - National Institute of Telecommunications, Brazil
   D. Brueckmann - University of Wuppertal, Germany
   J.A. Bucklew - University of Wisconsin, USA
   D.S. Budimir - University of Westminster, UK
   X.-R. Cao - The Hong Kong University of Science and Technology, PRC
   Y.T. Chan - The Chinese University of Hong Kong, PRC
   S. Chandran - URSI, Malaysia
   W.C. Chew - University of Illinois, USA
   J.F. Chicharo - University of Wollongong, Australia
   D. Cui - Bell Labs, Lucent Technologies, USA
   I.D.D. Curcio - Nokia Corporation, Finland
   S.K. Das - The University of Texas at Arlington, USA
   K. David - University of Kassel, Germany
   E. Del Re - University of Florence, Italy
   M. Djafor - City University of New York, USA
   I. Fair - University of Alberta, Canada
   C. Fan - Xidian University, PRC
   R. Fantacci - University of Florence, Italy
   A. Fapojuwo - University of Calgary, Canada
   R. Feick - Federal Technical University of Santa Maria, Chile
   B. Forssell - Norwegian University of Science and Technology, Norway
   M.M. Freire - University of Beira Interior, Portugal
   C.N. Georghiades - Texas A&M University, USA
   M. Ghanbari - University of Essex, UK
   Z.F. Ghassemlooy - Sheffield Hallam University, UK
   C. Gu - University of California - Santa Cruz, USA
   Z. Haas - Cornell University, USA
   J. Habermann - University of Applied Sciences, Germany
   R.H.M. Hafez - Carleton University, Canada
   K.  A.  Hamdi  -  University  of  Manchester  Institute of Science and
   Technology, UK
   M. Hegde - Washington University in Saint Louis, USA
   R.R. Henry - University of Louisiana at Lafayette, USA
   J. Horikoshi - Maebashi Institute of Technology, Japan
   P. Hosein - Ericsson Wireless Communiations Inc., USA
   X. Huang - Communications Research Centre Canada, Canada
   Y.-F.  Huang  -  National Yunlin University of Science and Technology,
   Taiwan
   B.L. Hughes - North Carolina State University, USA
   R. Hui - University of Kansas, USA
   H. G. Ilk - Ankara University, Turkey
   S. Jimaa - Etisalat College of Engineering, UAE
   J. Jordan - National Research Council of Canada, Canada
   M. Kavehrad - The Pennsylvania State University, USA
   D. Kazakos - University of Toledo, USA
   A.K. Khandani - University of Waterloo, Canada
   D. Kim - University of California - Santa Cruz, USA
   D.M. Klymyshyn - University of Saskatchewan, Canada
   H. Kobayashi - Princeton University, USA
   R. Kohno - Yokohama National University, Japan
   W. A. Krzymien - University of Alberta, Canada
   C.S. Lee - Southern Methodist University, USA
   T. Le-Ngoc - McGill University, Canada
   K.K. Leung - Bell Labs, Lucent Technologies, USA
   V.C.M. Leung - University of British Columbia, Canada
   Y.-W. Leung - Hong Kong Baptist University, PRC
   M. S Lim - Chonbuk National University, South Korea
   Z. Liu - Southeast Missouri State University, USA
   C. Lu - Nanyang Technological University, Singapore
   J.P. McGeehan - University of Bristol, UK
   C. McKinstrie - Lucent Technologies, USA
   P.S. Min - Washington University in Saint Louis, USA
   S.D. Morgera - Florida Atlantic University, USA
   C.S. Ng - National University of Singapore, Singapore
   G. Noubir - Northeastern University, USA
   T. O'Farrell - University of Leeds, UK
   S. Ovadia - Intel Corporation, USA
   T. Ozugur - ALCATEL Resource and Innovation Center, USA
   Y. Pan - Georgia State University, USA
   E. Panayirci - Isik University, Turkey
   P. Prucnal - Princeton University, USA
   S. Pupolin - University of Padova, Italy
   S. Reisenfeld - University of Technology Sydney, Australia
   M. Safak - Hacettepe University, Turkey
   M. Salehi - Northeastern University, USA
   S. Semnani - Btexact Technologies, UK
   S. Shen - University of Waterloo, Canada
   K. Sivalingam - Washington State University, USA
   D.G. Smith - University of Strathclyde, UK
   H. Sotobayashi - Ultrafast Photonic Network Group, USA
   J.R. Souza - Center of Telecommunications Studies - PUC/Rio, Brazil
   E.K. Stefanakos - University of South Florida, USA
   A. Svensson - Chalmers University of Technology, Sweden
   T.T. Tjhung - National University of Singapore, Singapore
   C.Y. Tong - Royal Military College, Canada
   L. Trajkovic - Simon Fraser University, Canada
   S. Valaee - University of Toronto, Canada
   L. Vandendorpe - Catholic University of Louvain, Belgium
   J.C. Vardaxoglou - Loughborough University, UK
   L. Vasiu - Middlesex University, UK
   A. Vukovic - Communications Research Centre Canada, Canada
   S.T. Vuong - University of British Columbia, Canada
   J.-H. Wen - National Chung Cheng University, Taiwan
   A. Willner - University of Southern California, USA
   M.E. Woodward - University of Bradford, UK
   A. Yener - Pennsylvania State University, USA
   A.F.M. Zain - Kolej Technological University Tun Hussein Onn, Malaysia
   S. Zeadally - Wayne State University, USA
   J.R. Zeidler - University of California - San Diego, USA
   A.M. Zoubir - Curtin University of Technology, Australia

   PAPER SUBMISSIONS 
   Submit your paper via our web site at:
   http://www.iasted.org/conferences/2003/banff/submit-383.htm.
   Files   larger  than  2MB  must  be  submitted  to  our  FTP  site  at
   ftp.actapress.com  (user  name:  actaftp; password: Journals1). If you
   submit a paper to our FTP site, please send a notification e-mail with
   your contact information to calgary@iasted.com. All submissions should
   be  in  Adobe  Acrobat  (.pdf),  Postscript  (.ps),  or MS Word (.doc)
   format. The IASTED Secretariat must receive your paper by February 14,
   2003.  Do  not  send  hard  copies  of  your  paper.  Receipt of paper
   submissions will be confirmed by e-mail.

   Please  provide  four  key  words to indicate the subject area of your
   paper.  One  of  the  key  words must be taken from the list of topics
   provided  under  Scope.  Include  a  statement  in  your  cover letter
   confirming  that  if  the  paper  is accepted, one of the authors will
   attend  the  conference  to  present  it. Please designate a principal
   author, and provide the full names, affiliations, addresses, telephone
   and fax numbers, and e-mail addresses of all authors.

   Notification  of acceptance will be sent via e-mail on March 14, 2003.
   Registration  payments  and  final manuscripts are due by May 1, 2003.
   Late  registration fees or paper submissions will result in the papers
   being  excluded  from  the  conference  proceedings. Please send final
   manuscripts  via  e-mail  or  FTP  site  using  the  same procedure as
   described above. The formatting instructions for final manuscripts can
   be  found on the Web and must be strictly followed. The page limit for
   final  papers  is  six  pages (single spaced). The additional page and
   page charges are USD $75.00 per page.

   TUTORIALS
   Proposals  for  half-day  tutorials  (three hours) should be submitted
   online  by February 14, 2003. Tutorials are to be submitted online via
   our following web site address:
   http://www.iasted.org/conferences/2003/banff/tutorialsubmit-383.htm
   A  tutorial  proposal  should  clearly  indicate the topic, background
   knowledge  expected  of the participants, objectives, time allocations
   for   the   major   course  topics,  and  the  qualifications  of  the
   instructor(s).

   SPECIAL SESSIONS
   Persons wishing to organize a special session should submit a proposal
   to  the  IASTED  Secretariat  by  February  14, 2003. Proposals should
   include  a  minimum  of  five  papers,  a session title, a list of the
   topics  covered,  and  qualifications of the session organizer(s). The
   name  of  the  session  organizer  will  appear  in  the  program  and
   proceedings  provided  five papers are presented. For more information
   on submitting a special session, please go to:
   http://www.iasted.org/conferences/2003/banff/sessionsubmit-383.htm.
   IMPORTANT DEADLINES
   Submissions due                                 February 14, 2003 
   Notification of acceptance                      March 14, 2003
   Registration, full payment and final papers due May 1, 2003

   For  more  information  or  to  be  placed on our mailing list, please
   contact:

   IASTED Secretariat - OCSN 2003
   #80, 4500 - 16th Avenue N.W., Calgary, AB, Canada T3B 0M6
   Tel: 403-288-1195, Fax: 403-247-6851
   Email: calgary@iasted.com
   Web site: http://www.iasted.org