CFP : IEEE Network Issue on Protection, Restoration, and Disaster Recovery
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Call for Papers 
IEEE Network  
 
Protection, Restoration, and Disaster Recovery  
 
Guest Editors: 
Debanjan Saha 
Tellium, Inc. 
2 Crescent Place,  
Oceanport, NJ 07757 
P: 732-923-4264 
E: debanjan_saha@ieee.org 

Satish Tripathi 
College of Engineering, 
University of California 
Riverside, CA 92521 
P: (909)-787-6374 
E: tripathi@engr.ucr.edu 
 
James Manchester 
Tellium, Inc. 
2 Crescent Place,  
Oceanport, NJ 07757 
P: 732-923-4283 
E:     manchester@ieee.org 
  
 
Scope: 

Technological innovations are enabling today's networks to carry
increasingly higher volumes of data, much of which is mission critical. As
networks grow and become an integral part of our daily lives, the
consequences of a failure become more pronounced. Even a brief outage can
result in the loss of very large amounts of critical information and disrupt
our day-to-day life and business. Network protection and automatic
restoration can minimize the impact of network failures. Such protection
mechanisms are generally implemented at several protocol layers and are the
subject of this special issue.
 
The objective of this special issue of IEEE Network Magazine is to assemble
a series of state-of-the-art articles on protection, restoration, and
disaster recovery in different layers of the network. In particular, we are
interested in tutorial, survey, and original research articles on, but not
limited to, the following topics:
 
·  Traditional SONET/SDH Ring protection mechanisms 
·  Optical mesh protection, Resilient Packet Ring (RPR)  
·  IP network restoration ­ MPLS, fast convergence of routing protocols 
·  Protection and restoration in ATM and Frame Relay networks 
·  Restoration in wireless and wireline telephone networks 
·  Signaling network (SS7 etc.) protection and recovery 
·  Disaster recovery in OSS and network management systems 
·  Resiliency at the application layer, protection of emergency services (e.g. 911) 
·  Multi-tier restoration and interaction of different layers  
·  Experimental studies, applications impact  
 
Submission Guidelines: 
Interested authors should submit an electronic version of the manuscript either in Postscript or PDF format 
as an email attachment to one of the guest editors. Additional information including "Guidelines for 
authors" is available at the IEEE Network Website: http://www.comsoc.org/pubs/net/ntwrk/authors.html  
 
Important Dates 
Submission Deadline: February 15, 2003 
Notification of Acceptance: June 15, 2003 
Final Manuscript Due: August 15, 2003 
Publication Date: November/December 2003