Call For Papers 
 
IEEE Communications Magazine 
 
Integration of Wireless LAN and 3G Wireless Technologies 
 
 
Scope 
 
After several years of research and standards activities, third generation (3G) wireless systems are 
beginning to be deployed, with NTT DoCoMo launching the first commercial service in October 
2001.  3G wireless is going through an evolution to all-IP core networks.  Meanwhile, wireless 
LAN (WLAN) technology is becoming increasingly popular for providing IP connectivity in 
corporate, campus, and other hotspot environments and is seen by some as a potential platform 
for 4G wireless.  WLAN technology is relatively cheap and quick to deploy, and provides high 
data rates.  On the other hand, 3G technology can provide wide-area coverage.  Do WLANs and 
3G networks have to compete, or can they be complementary?   
 
The complementary characteristics of 3G networks and WLANs has raised much interest in the 
integration of 3G and WLAN.  This topic has attracted much attention in the industry as well as 
in academia.  The integration between 3G wireless and WLAN is highly significant to make 
wireless multimedia and other high data rate services a reality to a large population. This special 
issue of IEEE Communications Magazine seeks to provide an opportunity to publish a series of 
state-of-the-art papers in the area of 3G and WLAN integration.  
 
Topics of interest include, but not limited to: 
 
·  Interworking architectures between 3G wireless and WLANs 
·  Services in integrated 3G wireless/WLAN environments 
·  Standardization activities in 3G/WLAN 
·  Mobility management in integrated 3G/WLAN architectures 
·  Authentication and security in integrated 3G/WLAN 
·  Network management and billing issues in integrated 3G/WLAN 
·  Hardware and software issues for mobile stations supporting integrated 3G and WLAN technologies 
·  Quality of service and policy issues 
·  Interworking of radio resource management 
·  Mapping of functions and services between 3G and WLAN 
 
Authors must follow the IEEE Communications Magazine guidelines regarding the manuscript 
and its format. For details, please refer to the "Information for Authors" in the IEEE 
Communications Magazine website (http://www.comsoc.org/pubs/commag/sub_guidelines.html)  
 
Please submit your electronic manuscript in word or pdf format to one of the guest editors by 
March 1, 2003. Earlier submissions are encouraged to allow for a better issue planning. 
 

Schedule 
 
Submission Deadline: March 1, 2003  
Acceptance Notification: June 1, 2003  
Final Manuscript Due: August 1, 2003  
Publication of Special Issue: November 2003 
 
Guest Editors 
 
Vijay K. Varma 
Telcordia Technologies 
331 Newman Springs Road 
Red Bank, NJ 07701 ­ USA 
+1 732-758-2811 
vvarma@telcordia.com 
 
K. Daniel Wong 
Telcordia Technologies 
331 Newman Springs Road 
Red Bank, NJ 07701 ­ USA 
+1 732-758-3481 
dwong@research.telcordia.com 
 
K-C Chua  
Siemens Private Limited 
ICM Mobile Core R&D Department 
75 Science Park Dr., #01-02 Cintech II 
Singapore Science Park I 
Singapore 118255 
+65 6879 9522 
keechaing.chua@siemens.com 
 
Frederic Paint 
Telenor A/S 
1331 Fornebu 
Norway     
+ 47 95810881 
frederic.paint@telenor.com