CFP : Special Issue of Elsevier Computer Communications on Protocol Engineering for Wired and Wireless Networks
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         Protocol Engineering for Wired and Wireless Networks

Guest Editors
Dr.   Peter   Langendoerfer   (IHP  microelectronics,  Frankfurt/Oder,
Germany); Prof. Vassilis Tsaoussidis (Northeastern University, Boston,
MA, USA)

Publication: WINTER 2003

Protocol  engineering  in  wired/wireless networks is a complex issue.
The   protocol  design  has  to  take  into  account  the  distinctive
characteristics  of  both  wired  and  wireless  networks  (e.g. error
characteristics),  the  constraints  of  user  (mobile)  devices (e.g.
battery  power,  limited resources), the constraints and operations of
the   network   devices  (e.g.  buffering  limitations  or  handovers,
respectively) and the requirements of user applications.

This special issue of Computer Communications seeks contributions that
tackle  the  above issues in the context of wired/wireless convergence
from  the  perspective of protocol design, implementation, evaluation,
analysis  and/or simulation. We also seek original contributions along
the  lines  of  wireless  or  wired  networks  alone  which,  however,
indirectly  impact  protocol/application  performance in heterogeneous
wired/wireless networks. Topics of interest include:

· Reliable transport wireless protocols
· Error Detection and Congestion Avoidance in Heterogeneous Networks
· Protocols for Wireless Multimedia Applications
· Protocols for Heterogeneous Networks
· Analysis   of   tradeoffs   (Energy,  Throughput,  Delay,  Jitter,
  Reliability, Fairness)
· Protocol  evaluation  with  non-traditional metrics (e.g. fairness,
  overhead, transmission/wasted effort, energy,
  and/or analysis of their correlation)
· Proxy-based solutions for wired/wireless networks
· Cross-layer optimization platforms

IMPORTANT DATES
Deadline for submissions: May 1 2003
Notification of acceptance: August 1 2003
Publication: Winter 2003

SUBMISSION GUIDELINES
Guidelines   on   how   to   present   your   paper   are   given   at
http://www.elsevier.com/journal/comcom.   We   particularly  encourage
submission  of  descriptive  papers  in  the  form  of  'open issues'.
Manuscripts  should  be  submitted  to  the  Guest Editors as an email
attachment, or a URL should be given where a PDF or postscript version
of their manuscript can be found:

Dr. Peter Langendoerfer 
IHP microelectronics
Im Technologie Park 25
15236 Frankfurt/Oder, Germany
Email: langendoerfer@ihp-microelectronics.com

Prof. Vassilis Tsaoussidis
Northeastern University
Boston, MA 02115
USA
Email: vassilis@ccs.neu.edu