Protocol Engineering for Wired and Wireless Networks
Guest Editors
Dr. Peter Langendoerfer (IHP microelectronics, Frankfurt/Oder,
Germany); Prof. Vassilis Tsaoussidis (Northeastern University, Boston,
MA, USA)
Publication: WINTER 2003
Protocol engineering in wired/wireless networks is a complex issue.
The protocol design has to take into account the distinctive
characteristics of both wired and wireless networks (e.g. error
characteristics), the constraints of user (mobile) devices (e.g.
battery power, limited resources), the constraints and operations of
the network devices (e.g. buffering limitations or handovers,
respectively) and the requirements of user applications.
This special issue of Computer Communications seeks contributions that
tackle the above issues in the context of wired/wireless convergence
from the perspective of protocol design, implementation, evaluation,
analysis and/or simulation. We also seek original contributions along
the lines of wireless or wired networks alone which, however,
indirectly impact protocol/application performance in heterogeneous
wired/wireless networks. Topics of interest include:
· Reliable transport wireless protocols
· Error Detection and Congestion Avoidance in Heterogeneous Networks
· Protocols for Wireless Multimedia Applications
· Protocols for Heterogeneous Networks
· Analysis of tradeoffs (Energy, Throughput, Delay, Jitter,
Reliability, Fairness)
· Protocol evaluation with non-traditional metrics (e.g. fairness,
overhead, transmission/wasted effort, energy,
and/or analysis of their correlation)
· Proxy-based solutions for wired/wireless networks
· Cross-layer optimization platforms
IMPORTANT DATES
Deadline for submissions: May 1 2003
Notification of acceptance: August 1 2003
Publication: Winter 2003
SUBMISSION GUIDELINES
Guidelines on how to present your paper are given at
http://www.elsevier.com/journal/comcom. We particularly encourage
submission of descriptive papers in the form of 'open issues'.
Manuscripts should be submitted to the Guest Editors as an email
attachment, or a URL should be given where a PDF or postscript version
of their manuscript can be found:
Dr. Peter Langendoerfer
IHP microelectronics
Im Technologie Park 25
15236 Frankfurt/Oder, Germany
Email: langendoerfer@ihp-microelectronics.com
Prof. Vassilis Tsaoussidis
Northeastern University
Boston, MA 02115
USA
Email: vassilis@ccs.neu.edu
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