2nd INTERNATIONAL
Conference on Wired/Wireless Internet Communications
WWIC 2004
FRANKFURT (ODER), GERMANY, February 05 - 07, 2004
WWIC 2004 (www.wwic2004.de) is the second annual conference dedicated to
bridging the gap between wired and wireless Internet. The issue of
integrating mobile devices in the Internet poses many challenges such as the
design and evaluation of protocols,the dynamics of the integration, the
performance tradeoffs, the need for new performance metrics, and the
cross-layer interactions. The goal of the conference is to present
high-quality results in the field, and to provide a framework for research
collaboration through focused discussions that will designate future
research efforts and directions. In this context, the program committee will
accept only a limited number of papers that meet the criteria of
originality, presentation quality and topic relevance.
The paper should not exceed 12 pages and the conference procceedings will be
published by Springer as LNCS (www.springer.de/comp/lncs/authors.html).
The program committee solicits research papers on the following issues:
* Network Design Issues on Wireless Internet
* Evaluation of Internet protocols over wireless networks
* Design and evaluation of new protocols
* Conflicting behavior of wired/wireless protocols/mechanisms
* Error and Congestion Control
* Quality of Service
* Energy Efficiency of protocols and devices
* Performance Tradeoffs
* Wired/Wireless Proxies
* Web Computing
* System Design and Evaluation
* Cross-layer interactions
* Applications and Application Performance
* Middleware platforms
* Evaluation Tools and Methods
* Modeling and Simulation for wired/wireless networks
General Chairs
Vassilis Tsaoussidis, Demokritos University, Greece
Ibrahim Matta, Boston University, USA
TPC Chairs
Peter Langendoerfer, IHP, Germany
Mingyan Liu, University of Michigan, USA
Important dates
Submission deadline: October 24, 2003
Notification of acceptance: November 12, 2003
Camera ready papers: November 26, 2003
Program Commitee
Farooq Anjum, Telcordia Technologies, USA
Torsten Braun, University Bern, Switzerland
Xiuzhen Cheng, George Washington University, USA
Mark Crovella, Boston University, USA
Klaus David, University of Kassel, Germany
Olaf Droegehorn, University of Kassel, Germany
Yuguang Fang, University of Florida, USA
Jennifer Hou, University of Illinois at Urbana Champaign, USA
Yevgeni Koucheryavy, Tampere University of Technology, Finland
Rolf Kraemer, IHP Microelectronics, Germany
Srikanth Krishnamurthy, University of California, Riverside, USA
Adrian Lahanas, Demokritos Research Center, Greece
Peter Langendoerfer, IHP Microelectronics, Germany
Victor Leung, Univeristy of British Columbia, Canada
Ben Liang, University of Toronto, Canada
Mingyan Liu, University of Michigan, USA
Qingchong Liu, University of Oakland, USA
Henning Maass, Philips Research Laboratories, Aachen
Petri Maehoenen, University Oulu, Finland
Qusay Mahmoud, Guelph University, Canada
Christian Maihoefer, DaimlerChrysler, Germany
Ibrahim Matta, Boston University, USA
Ioanis Nikolaidis, University of Alberta, Canada
Guevara Noubir, Northeastern University, USA
Jianping Pan, Fujitsu, USA
George Polyzos, AUEB, Greece
Jochen Schiller, FU Berlin, Germany
Sherman Shen, University of Waterloo, Canada
Ioannis Stavrakakis, University of Athens, Greece
Vassilis Tsaoussidis, Demokritos University, Greece
Dapeng Oliver Wu, University of Florida, USA
Chi Zhang, Florida International University, USA
Yongguang Zhang, Hughes Research Labs, USA
Martina Zitterbart, TU Karlsruhe, Germany
Michele Zorzi, University of Ferrara, Italy
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